Learn about chiplets
Read the published explainers before choosing a listing.
Die-to-die IP
Published UCIe controllers and PHYs. A listing is not a chiplet for sale, a license, or proof that products work together.
Interconnects
On-chip networks and SerDes published with die-to-die IP.
Integration, packaging & test
Packaging platforms, substrates, test systems, and physical-design tools.
Published solutions
Die-to-die IP
Interconnects
- Analog Bits Multi-protocol PCIe-class SerDes IPDesign IP
- Analogix DisplayPort 1.1a Transmitter IPDesign IP
- Arm Neoverse CMN S3Design IP
- Arteris FlexWay Interconnect IPDesign IP
- Arteris Ncore Cache Coherent Interconnect IPDesign IP
- Baya Systems WeaveIP NoC Fabric IPDesign IP
- Credo SerDesDesign IP
- eTopus ePHY Multi-protocol SerDes IP (1–112G)Design IP
- Euresys / Allied Vision Vision Standard IP CoresDesign IP
- FermionIC Multi-Protocol SERDES IPDesign IP
- FlexGen Multi-Die NoC IPDesign IP
- FlexNoCDesign IP
- InCirT Broadband Data Conversion Silicon IPDesign IP
- Kandou Glasswing Chiplet Interconnect IPDesign IP
- OPENEDGES OICDesign IP
- RAMSCHIP ADC-Based SerDes IPDesign IP
- StarIC SerDes and Electro-Photonic Interconnect IPDesign IP
- StreamDSP VITA 17.3 sFPDP-Gen3 IP CoreDesign IP
- Synopsys Multi-Protocol 10G PHY IPDesign IP
- Teletrx 112G SerDes / CDR IPDesign IP
- Trilinear DisplayPort Transmitter Link ControllerDesign IP
Integration, packaging & test
- 2nm Design PlatformPhysical-design tool
- AMD 3D V-CachePackaging
- APTURA Thermo-Compression BondingPackaging equipment
- Cadence Integrity 3D-IC PlatformPhysical-design tool
- Datacon 8800 CHAMEO Hybrid BondingPackaging equipment
- DiamondxTest
- Dual TC BonderPackaging equipment
- FOX-XPTest
- High-Performance IC Substrate PlatformPackaging
- Intel EMIB Advanced PackagingPackaging
- Intel FoverosPackaging
- SWIFT High-Density Fan-OutPackaging
- Synopsys Fusion CompilerPhysical-design tool
- TSMC 3DFabricPackaging
- TSMC CoWoS Advanced PackagingPackaging
- TSMC InFO Advanced PackagingPackaging
- TSMC SoIC 3D IntegrationPackaging
- V93000 EXA ScaleTest
- VIPackPackaging
Related insights
Related events
March 30 – April 1, 2027
Chiplet Summit 2027
Santa Clara, California, USA
March 1 – 4, 2027
IMAPS Device Packaging Conference 2027
Chandler, Arizona, USA