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Kandou Glasswing Chiplet Interconnect IP

The Glasswing Chiplet Interconnect IP page reviewed on 12 November 2026 describes Glasswing as chip-to-chip link IP using CNRZ-5 Chord signaling for more bits with lower power and fewer pins.

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Overview

Kandou Glasswing is licensable ultra-short-reach (USR) chiplet interconnect SerDes IP using CNRZ-5 Chord signaling.

Marketing claims include USR SerDes proven in low-cost silicon, about 1 Tbps bandwidth under one watt class efficiency, tiling for terabit die-to-die bandwidth, beachfront bandwidth of 208 Gbit/s/mm die edge, 6 dB insertion-loss budget (40+ mm on GZ-41 substrate), standard 150 µm bump pitch without interposer, low fixed latency, native BER 1E-15 with optional FEC to below 1E-20, PRBS/loopback, protocol-agnostic operation, and built-in EyeScope diagnostics. Product SKU GW12-500-USR lists peak throughput 500 Gbits/s, bandwidth density 208.3 Gbit/s per mm of die edge, CNRZ-5 on 6 wires, and process GlobalFoundries 12LP. Feature list also states 500 Gbits/s bidirectional throughput and 1.04 pJ/bit or 1 Tbit/s per Watt efficiency figures. Official product page confirms Glasswing USR SerDes chiplet interconnect IP with named SKU and foundry node.

Technical capabilities

  • Published as design IP

    Licensable semiconductor IP. This listing is not a finished controller chip.

  • PHY IP

    Physical-layer IP. Controllers are separate listings unless the page states a bundle.

  • Finder function

    USR chiplet SerDes

  • Numbered specification: GW12-500-USR on GF 12LP

    GW12-500-USR on GF 12LP is named for this product on the reviewed page.

Lifecycle and categories

Solution categories
SerDes IP
Supported versions
Glasswing USR; CNRZ-5 Chord; GW12-500-USR on GF 12LP
Compatibility
GF 12LP SKU stated; substrate package (no silicon interposer) at 150 µm bump pitch. Source

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