Foundries
A manufacturer’s wafer line or foundry ecosystem.
Fabrication & Prototyping
Foundries, processes and shuttle services.
Process offerings
One published process node or specialty process.
MPW prototyping
A shared shuttle run, not a process node or fabrication equipment.
Packaging & qualification
Packaging platforms, substrates, and test systems.
Published solutions
Process offerings
- 22ULP/ULLProcess offering
- 28nm HKMG ProcessProcess offering
- BCD / UHV / SOI Foundry PlatformProcess offering
- Embedded Memory Process PlatformProcess offering
- GlobalFoundries 22FDX FD-SOIProcess offering
- III-V Foundry Process PlatformProcess offering
- RH90Process offering
- Samsung GAA MBCFET ProcessProcess offering
- SiGe BiCMOS PlatformProcess offering
MPW prototyping
Packaging & qualification
- AMD 3D V-CachePackaging
- APTURA Thermo-Compression BondingPackaging equipment
- Datacon 8800 CHAMEO Hybrid BondingPackaging equipment
- DiamondxTest
- Dual TC BonderPackaging equipment
- FOX-XPTest
- High-Performance IC Substrate PlatformPackaging
- Intel EMIB Advanced PackagingPackaging
- Intel FoverosPackaging
- SWIFT High-Density Fan-OutPackaging
- TSMC 3DFabricPackaging
- TSMC CoWoS Advanced PackagingPackaging
- TSMC InFO Advanced PackagingPackaging
- TSMC SoIC 3D IntegrationPackaging
- V93000 EXA ScaleTest
- VIPackPackaging
Equipment
View categoryEpitaxy, inspection, and metrology systems, listed apart from foundry processes.
