NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
TSMC CoWoS Advanced Packaging
TSMC CoWoS is a publicly named 2.5D advanced packaging platform that places logic dies and high-bandwidth memory on an interposer for high-performance computing and AI products.
Overview
Official TSMC pages describe Chip-on-Wafer-on-Substrate as a wafer-level integration service in volume production since 2012. Named interposer options include silicon (CoWoS-S), redistribution-layer (CoWoS-R) and local-silicon-interconnect (CoWoS-L) constructions; those remain capabilities of this platform rather than separate listings. CoWoS is a constituent of the 3DFabric family and is distinct from TSMC-SoIC frontend stacking and InFO fan-out. Interposer sizes, design rules and current service options should be confirmed on TSMC’s CoWoS pages.
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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