NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Intel EMIB Advanced Packaging
Intel EMIB is Intel Foundry’s publicly named Embedded Multi-die Interconnect Bridge platform for 2.5D chiplet assembly.
Overview
Official packaging pages describe a small silicon bridge embedded in the package substrate to connect logic-to-logic or logic-to-HBM dies shoreline-to-shoreline, avoiding a full-reticle silicon interposer. Intel states the technology has been in high-volume manufacturing since 2017 with Intel and external silicon. Named bridge options such as EMIB-M and EMIB-T remain capabilities of this platform. EMIB is listed separately from Foveros 3D stacking; combined EMIB 3.5D constructions are not a separate listing. Design rules and current availability should be confirmed on Intel Foundry packaging pages.
Technical capabilities
Described for logic-to-logic and logic-to-HBM connections
Distinct from Intel Foveros 3D stacking, which is listed separately
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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