NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Datacon 8800 CHAMEO Hybrid Bonding
Datacon 8800 CHAMEO Hybrid Bonding is a publicly named Besi assembly-equipment family.
Overview
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
This listing records the hybrid-bonding platform rather than every Besi die-attach tool. Process options should be confirmed on Besi’s current product pages.
Technical capabilities
Advanced-packaging assembly rather than wafer etch
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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