2.5D/3D Multi-die Advanced Packaging Technology Platform
Design ServicesGUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
View solutionPackaging and chiplets
2.5D/3D integration, advanced packaging, substrates and interposers.
Showing 1–12 of 22 solutions.
Provider
2.5D/3D Multi-die Advanced Packaging Technology Platform
Design ServicesAMD 3D V-Cache
Packaging
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
View solutionAPTURA Thermo-Compression Bonding
Packaging
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
View solutionCamtek Eagle inspection and metrology platform
Manufacturing Equipment
Inspection and metrology equipment for semiconductor and advanced-packaging manufacturing.
View solutionDBG + DAF Laser Cut
Packaging and chiplets
DISCO DBG with DAF laser cut is a dicing-before-grinding process that laser-cuts die-attach film during wafer thinning.
View solutionDatacon 8800 CHAMEO Hybrid Bonding
Packaging
Besi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
View solutionDragonfly G5 Inspection System
Manufacturing Equipment
Onto describes the Dragonfly G5 as a pattern inspection system for inline process control of advanced packaging, including submicron defect detection and high-resolution 3D measurement.
View solutionDual TC Bonder
Packaging
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
View solutionERS Fully Automated 310 × 310 mm Panel-Level Packaging System
Packaging and chiplets
Fully automated 310 × 310 mm panel-level packaging system from ERS electronic that integrates temporary carrier bonding, debonding and detaping. The first unit has been delivered to a semiconductor manufacturer for panel-line integration.
View solutionHigh-Performance IC Substrate Platform
Packaging
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
View solutionIntel EMIB Advanced Packaging
Packaging
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
View solutionIntel Foveros
PackagingIntel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.
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