NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
DBG + DAF Laser Cut
DBG + DAF Laser Cut is a publicly described DISCO dicing and grinding process.
Overview
Official DISCO solution pages present dicing before grinding combined with laser cutting of die-attach film. This listing records that named process rather than every DISCO dicer or grinder model. Process applicability should be confirmed on DISCO’s current solution pages.
Technical capabilities
Process listing rather than a tool-SKU catalog
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
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