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Public source
2.5D/3D Multi-die Advanced Packaging Technology Platform
2.5D/3D Multi-die Advanced Packaging Technology Platform is a publicly named GUC ASIC service covering CoWoS, InFO, SoIC and related multi-die design.
Overview
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
Official GUC APT materials describe IP, SI/PI co-simulation and manufacturing handoff for AI, HPC and networking ASICs. This listing records APT rather than every GUC case study.
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Design Services
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