2.5D/3D Multi-die Advanced Packaging Technology Platform
Design ServicesGUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
View solutionServices & Manufacturing
Design Services
RTL, integration, and SoC design services. This is work performed for a customer, not a catalog IP core.
Showing 1–12 of 12 solutions.
2.5D/3D Multi-die Advanced Packaging Technology Platform
Design ServicesBroadcom Custom Silicon ASIC solutions
Design Services
Custom ASIC programs for customer-specific high-performance silicon.
View solutionElmos ASIC design services
Design Services
Customer-specific ASIC development from a mixed-signal semiconductor supplier.
View solutionFlexIC Foundry
Design Services
Pragmatic describes the FlexIC Foundry as fabrication of flexible thin-film ASICs, using industry-standard ASIC design flows and taking a design from tape-out to delivery.
View solutionInfineon custom ASIC development
Design Services
Custom ASIC development combining analog, mixed-signal, power, or security expertise.
View solutionMarvell Custom ASIC solutions
Design Services
Custom ASIC development and integration for demanding compute and connectivity designs.
View solutionMediaTek Custom ASIC Services
Design Services
Customer-specific ASIC development using MediaTek silicon design capabilities.
View solutionMosChip Silicon Engineering Services
Design Services
Silicon engineering services. Physical design and sign-off are documented on the design-services page. Package, assembly, ATE test, and qualification are documented on the turnkey page as coordination with foundry and OSAT partners.
View solutionQualcomm Dragonfly custom silicon
Design Services
Custom-silicon development for customer-specific data-center SoCs.
View solutionRenesas custom ASIC SoC solutions
Design Services
Customer-specific IC design with implementation and manufacturing support.
View solutionSilicon Platform as a Service (SiPaaS)
Design Services
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
View solutionimec IC-link ASIC development
Design Services
ASIC services through imec IC-link, including package design, assembly through partner assembly houses, and test and qualification through partner test houses. Physical design and timing signoff are not named on the reviewed pages.
View solution
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