AGNIT GaN wafer and device development
Manufacturing MaterialsGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionServices & Manufacturing
Manufacturing Materials
Wafers, substrates, epitaxy, and process materials. Supplying a material is not a CMOS foundry service and not design IP.
Showing 1–9 of 9 solutions.
AGNIT GaN wafer and device development
Manufacturing MaterialsAXT InP, GaAs, and Ge substrates
Manufacturing Materials
Compound-semiconductor substrates for suitable RF, photonics, and semiconductor manufacturing flows.
View solutionCoherent SiC epitaxial wafers
Manufacturing Materials
Silicon-carbide epitaxial wafers for suitable semiconductor fabrication processes.
View solutionEntegris CMP materials and process consumables
Manufacturing Materials
CMP materials and associated consumables for semiconductor fabrication processes.
View solutionGlobalWafers silicon wafer products
Manufacturing MaterialsSilicon wafer product families for semiconductor manufacturing.
View solutionIC1000 CMP Pads
Manufacturing Materials
Qnity lists the IC1000 series as hard CMP polishing pads for copper bulk, tungsten, STI and ceria, oxide, and buff.
View solutionSUMCO Silicon Wafers
Manufacturing Materials
SUMCO describes silicon wafers as polished disks sliced from high-purity silicon and used as the starting material for semiconductor devices.
View solutionSoitec Engineered Substrates
Manufacturing Materials
Soitec lists engineered-substrate platforms including FD-SOI, RF-SOI, Power-SOI, and Photonics-SOI.
View solutionWolfspeed SiC Substrates and Epitaxy
Manufacturing Materials
Wolfspeed lists conductive n-type silicon carbide substrates and customized SiC epitaxy for power electronics, including 200 mm n-type wafers.
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