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IC1000 CMP Pads

Qnity lists the IC1000 series as hard CMP polishing pads for copper bulk, tungsten, STI and ceria, oxide, and buff.

Overview

It is not design IP. The retired Emblem platform slug is not reused. Confirm the pad in the series and the CMP step it is specified for.

Technical capabilities

  • Availability

    Listed by the provider. Confirm the configuration before use.

  • Configuration checks

    Confirm the pad in the series and the CMP step it is specified for.

Lifecycle and categories

Lifecycle stages
Wafer fabrication
Solution categories
Manufacturing Materials
Compatibility
Pricing, licensing, and configuration availability require provider confirmation. Source

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