22ULP/ULL
FoundriesUMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solutionWafer fabrication
Foundries, process nodes and specialty processes.
Showing 1–12 of 40 solutions.
Provider
22ULP/ULL
Foundries28nm HKMG Process
Foundries
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry
Foundries3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionAGNIT GaN wafer and device development
Manufacturing Materials
GaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionAIXTRON G10-SiC epitaxy system
Manufacturing Equipment
Epitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionASM Atomic Layer Deposition (ALD)
Wafer fabrication
ASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
View solutionASM Epitaxy
Wafer fabricationASM epitaxy is a crystalline film-growth equipment platform covering silicon and silicon-germanium transistor epitaxy and silicon carbide epitaxy. Distinct from ASM atomic layer deposition.
View solutionASML TWINSCAN DUV Lithography
Wafer fabrication
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
View solutionASML TWINSCAN EXE High-NA EUV
Wafer fabricationASML High-NA EUV lithography platform (TWINSCAN EXE) using 0.55 numerical aperture optics. Distinct from 0.33 NA TWINSCAN NXE EUV systems.
View solutionASML TWINSCAN NXE EUV Lithography
Wafer fabricationASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
View solutionAXT InP, GaAs, and Ge substrates
Manufacturing Materials
Compound-semiconductor substrates for suitable RF, photonics, and semiconductor manufacturing flows.
View solutionApplied Materials Endura PVD
Wafer fabricationApplied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
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