Ultra C Wet-Processing Platform
Wafer fabricationACM Ultra C is a wet-clean and wet-process equipment family, not an IR homepage listing.
View solutionWafer fabrication
Foundries, process nodes and specialty processes.
Showing 37–40 of 40 solutions.
Provider
Ultra C Wet-Processing Platform
Wafer fabricationUniversal-H300
Wafer fabrication
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
View solutionWolfspeed SiC Substrates and Epitaxy
Manufacturing Materials
Wolfspeed lists conductive n-type silicon carbide substrates and customized SiC epitaxy for power electronics, including 200 mm n-type wafers.
View solutionc.HORICOO 300
Wafer fabrication
centrotherm c.HORICOO 300 is a 300 mm horizontal furnace platform, not a deposition-materials consumable.
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