
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Ultra C Wet-Processing Platform is a publicly named ACM Research wet-process family.
Official ACM Ultra C pages describe wet-bench and related Ultra C tools for wafer cleaning and stripping. The recovery uses the live acmr.com Ultra C product URL rather than the IR homepage. This listing records Ultra C rather than every ACM SAPS/TEBO SKU.
Not a dry-etch listing
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solutionSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionEpitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
View solution