
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
3D AI Foundry is a publicly named Powerchip foundry ecosystem.
Official PSMC COMPUTEX 2026 materials describe 3D wafer-on-wafer DRAM-and-logic stacking plus interposer and IPD elements. This listing records the 3D AI Foundry offering rather than a single event booth.
Not a discrete DRAM product listing
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solutionSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solutionBCD / UHV / SOI Foundry Platform is Vanguard’s publicly named specialty-foundry process set.
View solutionElite360 GaN & GaAs Foundry is a publicly named Qorvo foundry offering.
View solutionHua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.
View solution22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
View solution