2.5D/3D Multi-die Advanced Packaging Technology Platform
Design ServicesGUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
View solutionServices & Manufacturing
Services and manufacturing partners. A foundry is not a packaging house, and a design service is not licensable IP unless the listing says both.
Showing 1–12 of 92 solutions.
2.5D/3D Multi-die Advanced Packaging Technology Platform
Design Services22ULP/ULL
Foundries
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solution28nm HKMG Process
Foundries
SMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry
Foundries3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionAGNIT GaN wafer and device development
Manufacturing Materials
GaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionAIXTRON G10-SiC epitaxy system
Manufacturing Equipment
Epitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionAMD 3D V-Cache
Packaging
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
View solutionAOS AOZ22645QI buck regulator
System Components
A buck-regulator IC for board-level power delivery.
View solutionAPTURA Thermo-Compression Bonding
Packaging
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
View solutionAXT InP, GaAs, and Ge substrates
Manufacturing Materials
Compound-semiconductor substrates for suitable RF, photonics, and semiconductor manufacturing flows.
View solutionAheesa Vihaan networking SoC platform
Commercial SoCsA provider-described RISC-V networking SoC platform for networking and edge systems.
View solutionAllegro current-sensor ICs
System Components
Current-sensing IC families for system power measurement and control.
View solution
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