TSMC CyberShuttle
FoundriesTSMC CyberShuttle is a multi-project wafer prototyping service. It is a foundry service, not a process node and not fabrication equipment.
View solutionServices & Manufacturing
Services and manufacturing partners. A foundry is not a packaging house, and a design service is not licensable IP unless the listing says both.
Showing 85–92 of 92 solutions.
TSMC CyberShuttle
FoundriesTSMC InFO Advanced Packaging
PackagingTSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
View solutionTSMC SoIC 3D Integration
PackagingTSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
View solutionV93000 EXA Scale
Test & Qualification
Advantest V93000 EXA Scale is a flagship SoC automatic test equipment platform for high-volume digital, mixed-signal and high-speed I/O devices.
View solutionVIPack
Packaging
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
View solutionVaultIC408
System Components
SEALSQ describes the VaultIC408 as a secure element with tamper-resistant storage, elliptic-curve services up to 572 bits, and FIPS 140-3 CMVP certification.
View solutionWolfspeed SiC Substrates and Epitaxy
Manufacturing Materials
Wolfspeed lists conductive n-type silicon carbide substrates and customized SiC epitaxy for power electronics, including 200 mm n-type wafers.
View solutionimec IC-link ASIC development
Design Services
ASIC services through imec IC-link, including package design, assembly through partner assembly houses, and test and qualification through partner test houses. Physical design and timing signoff are not named on the reviewed pages.
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