
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
VIPack is a publicly named ASE Technology Holding advanced-packaging platform.
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
Official ASE VIPack pages present the family as a heterogeneous-integration offering spanning fan-out, 2.5D and related constructions. This listing records the VIPack platform rather than every ASE package type. Construction options should be confirmed on ASE’s current VIPack pages.
OSAT platform rather than a foundry process
3D V-Cache stacks an L3 cache tile on a CPU core-complex die using copper-to-copper hybrid bonding and TSVs. Official AMD materials call it the first x86 true 3D die stack, with much higher interconnect density versus 2D chiplets.
View solutionKulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
View solutionBesi Datacon 8800 CHAMEO is a hybrid-bonding die-attach platform for copper-to-copper and related advanced-package construction.
View solutionHANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
View solutionAT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
View solutionIntel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
View solution