NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Dual TC Bonder
Dual TC Bonder is a publicly named HANMI Semiconductor HBM equipment family.
Overview
Official HANMI product pages present Dual TC Bonder tools (Dragon, Griffin, Tiger and related) for thermocompression stacking of HBM. This listing records the Dual TC Bonder platform rather than every bonder variant. Throughput claims should be taken from HANMI’s current product pages.
Technical capabilities
Die-stack assembly rather than wafer etch
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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