Intel Foveros

Public Intel Foundry pages describe Foveros-S 2.5D assembly on a silicon interposer, Foveros-R 2.5D using redistribution-layer fan-out, and Foveros Direct 3D, which uses copper-to-copper hybrid bonding for vertical stacking. Those named Foveros variants remain capabilities of this family rather than separate listings. Intel also notes compatibility with chiplet interconnect approaches such as UCIe. EMIB, a silicon-bridge 2.5D interconnect described on the same Foundry packaging pages, is listed independently. Process options, design rules and current availability should be confirmed on Intel’s official packaging pages.