What It Is
Advanced packaging now sits beside process-node choice as a way to combine logic, memory and I/O. 2.5D interposers, embedded bridges, fan-out and 3D stacking let designers assemble systems from chiplets rather than a single monolithic die.
Why It Matters
AI and high-performance systems already depend on packaging to attach high-bandwidth memory and to connect heterogeneous dies. Architecture is no longer only a silicon-floorplan problem.
What to Watch
Watch 2.5D and 3D platform roadmaps, how chiplets are partitioned, and which interconnect and bonding methods foundries and IDMs standardize on.
