NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
TSMC SoIC 3D Integration
TSMC-SoIC is TSMC’s publicly named wafer-level frontend 3D stacking platform for re-integrating chiplets into a compact stacked chip.
Overview
Official TSMC 3DFabric pages describe SoIC as a high-density bonding service that can later be assembled with conventional packages or with backend 3DFabric services such as CoWoS. Chip-on-wafer and wafer-on-wafer schemes are described as capabilities of this platform, not as independent listings. SoIC is grouped under the 3DFabric family and is distinct from CoWoS 2.5D interposer packaging and from InFO fan-out. Bonding pitches, node compatibility and service options should be confirmed on TSMC’s SoIC pages.
Technical capabilities
Wafer-level frontend 3D chip stacking for homogeneous and heterogeneous chiplets
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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