NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
TSMC InFO Advanced Packaging
TSMC InFO is a publicly named wafer-level integrated fan-out packaging platform.
Overview
Official TSMC pages describe high-density redistribution layers and through-InFO vias used to integrate dies for mobile and high-performance computing, with high-volume shipments described since 2016. Named constructions such as InFO-PoP for mobile application processors with DRAM and InFO-oS for multi-chiplet logic remain capabilities of this platform rather than separate listings. InFO is a constituent of the 3DFabric family and is distinct from CoWoS 2.5D interposer packaging and from TSMC-SoIC frontend stacking. Design rules and current service options should be confirmed on TSMC’s InFO pages.
Technical capabilities
Through-InFO vias for vertical interconnect
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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