Secure IoT S2401
Commercial SoCsMindgrove describes the S2401 as a microcontroller for IoT and embedded devices, with an integrated RISC-V Shakti core, hardware crypto accelerators, and on-chip secure memory.
View solutionServices & Manufacturing
Services and manufacturing partners. A foundry is not a packaging house, and a design service is not licensable IP unless the listing says both.
Showing 73–84 of 92 solutions.
Secure IoT S2401
Commercial SoCsSensesemi SenseSoC platform
Commercial SoCs
A provider-described IoT and medical-IoT SoC platform with MCU, connectivity, and edge-processing functions.
View solutionSiGe BiCMOS Platform
Foundries
Tower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.
View solutionSiTime MEMS Timing Components
System Components
SiTime publishes MEMS timing products, including oscillators, TCXOs, OCXOs, and resonators.
View solutionSignalchip LTE Base Station Chipsets
Commercial SoCsSignalchip describes LTE base-station chipsets for residential through high-performance cells, and RF chipsets for 5G NR, LTE, and WCDMA.
View solutionSilicon Labs EFR32MG26 wireless SoCs
Commercial SoCs
Multiprotocol wireless SoCs for mesh IoT and connected-device designs.
View solutionSilicon Platform as a Service (SiPaaS)
Design Services
VeriSilicon SiPaaS is a platform-based custom-silicon design and turnkey service, not a foundry process node.
View solutionSkyWater Multi-Project Wafer Services
Foundries
SkyWater Multi-Project Wafer services are a foundry shuttle for prototyping, IP verification, and device characterization. This is a fabrication service, not a process node and not fabrication equipment.
View solutionSmartSens CMOS Image Sensors
System Components
SmartSens lists CMOS image-sensor series for security, automotive, smartphone, industrial, and medical applications.
View solutionSoitec Engineered Substrates
Manufacturing Materials
Soitec lists engineered-substrate platforms including FD-SOI, RF-SOI, Power-SOI, and Photonics-SOI.
View solutionTSMC 3DFabric
Packaging
TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.
View solutionTSMC CoWoS Advanced Packaging
PackagingTSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
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