Silicon Showcase⁠™

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Public source

TSMC 3DFabric

TSMC 3DFabric is TSMC’s named family of 3D silicon stacking and advanced packaging, grouping frontend stacking and backend packaging used to assemble systems of smaller chips rather than a single large monolithic die.

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Overview

CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.

Official 3DFabric pages name TSMC-SoIC, CoWoS and InFO as the constituent solutions for homogeneous and heterogeneous integration in high-performance compute and related designs. CoWoS, TSMC-SoIC and InFO are independent Silicon Showcase⁠™ listings. Interposer or fan-out variants such as CoWoS-S, CoWoS-L, CoWoS-R and InFO-PoP remain capabilities of those platforms, not separate listings. Foundry process details, design kits and service options remain with TSMC.

Technical capabilities

  • Umbrella family covering 3D silicon stacking and advanced packaging

  • Does not replace the separate CoWoS, TSMC-SoIC and InFO listings

Lifecycle and categories

Lifecycle stages
Packaging and chiplets
Solution categories
Packaging

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APTURA Thermo-Compression Bonding

Packaging

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Dual TC Bonder

Packaging

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Packaging

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Intel EMIB Advanced Packaging

Packaging

Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.

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Related events

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NOV152026
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SC26

  • November 15 – 20, 2026
  • Chicago, Illinois, USA
  • Organized by SC Conference Series
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