
DVCon Europe 2026
- November 17 – 18, 2026
- Munich, Germany
- Organized by Accellera Systems Initiative
Public source
imec IC-link describes ASIC design that can start from a specification, RTL, netlist, placed gates, or GDSII, combining its team with design partners.
ASIC services through imec IC-link, including package design, assembly through partner assembly houses, and test and qualification through partner test houses. Physical design and timing signoff are not named on the reviewed pages.
This is not MosChip and not a license to imec research IP.
Design service
imec IC-link describes ASIC development, including prototype paths such as MPW. This is not MosChip and not a license to imec research IP.
Availability
Listed by the provider. Confirm the configuration before use.
Implementation target
ASIC engagement
Configuration checks
Confirm foundry/process access, PDK and IP terms, design support, shuttle schedule, package, test, and manufacturing scope.
Recorded aliases
IC-link; MPW; ASIC prototyping
Workstream packaging
The IC packaging page documents package design, electrical simulation, and package layout. The ASIC services page says the team and partners support wire-bond, flip-chip, and 2.5D/3D package designs.
Workstream assembly
The ASIC services page says prototype and volume packaging are provided through leading assembly houses. IC-link coordinates those partners.
Workstream test-development
The test page says test software and hardware are developed through IC-link partners, including a test specification and the hardware and software for wafer sort and final test.
Workstream production-test
The test page describes production test through partner test houses and names Teradyne UltraFLEX and Advantest V93000. It does not say IC-link operates every test floor.
Workstream qualification
The test page lists qualification services, including AEC-Q100, JESD22, JESD47, MIL-STD-883, and ESCC evaluation where those flows are named. Which flow applies still has to be confirmed.
Workstream url packaging
https://www.imeciclink.com/en/asic-services/ic-packaging
Workstream url assembly
https://www.imeciclink.com/en/asic-services
Workstream url test-development
https://www.imeciclink.com/en/asic-services/asic-test-qualification-and-production-optimization-services
Workstream url production-test
https://www.imeciclink.com/en/asic-services/asic-test-qualification-and-production-optimization-services
Workstream url qualification
https://www.imeciclink.com/en/asic-services/asic-test-qualification-and-production-optimization-services
Engagement model
turnkey. The ASIC services page describes flexible turnkey services and one partner that combines IC-link with its design, assembly, and test network. Stages the reviewed pages do not name are outside this listing.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
View solutionCustom ASIC programs for customer-specific high-performance silicon.
View solutionCustomer-specific ASIC development from a mixed-signal semiconductor supplier.
View solutionPragmatic describes the FlexIC Foundry as fabrication of flexible thin-film ASICs, using industry-standard ASIC design flows and taking a design from tape-out to delivery.
View solutionCustom ASIC development combining analog, mixed-signal, power, or security expertise.
View solutionCustom ASIC development and integration for demanding compute and connectivity designs.
View solution
