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Taiwan
ASIC company that publishes 2.5D/3D multi-die advanced-packaging design platforms.
2 published solutions.
Licensable HBM4E PHY and controller IP, published as one combined interface. GUC says it is design-ready, states speeds up to 16 Gbps, and says the PHY has taped out on TSMC N2P with CoWoS-L. GUC’s silicon-proven statement for its earlier HBM4 IP is not recorded here.
GUC APT is a 2.5D/3D multi-die ASIC packaging-design platform, not a foundry process node and not OSAT assembly.
