NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
ASM Atomic Layer Deposition (ALD)
ASM publishes atomic layer deposition equipment and process technology for semiconductor manufacturing.
Overview
Official pages describe ALD as a surface-controlled, layer-by-layer method that deposits ultrathin conformal films by alternating precursor and reactant pulses. ASM presents thermal ALD and plasma-enhanced ALD for advanced logic, memory and packaging structures, including high-k dielectrics and related film applications. This independent listing identifies the named ALD technology category rather than individual tool models. Process recipes, film stacks and tool configurations should be confirmed on ASM's current ALD pages.
Technical capabilities
Thermal ALD and plasma-enhanced ALD process options described by ASM
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
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