NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
ASM Epitaxy
ASM publishes epitaxy equipment and process technology for growing crystalline films on semiconductor wafers.
Overview
Official epitaxy pages describe silicon, silicon-germanium and phosphorous-doped silicon films used to form strained channel and source/drain regions in advanced transistors, plus selective epitaxy and surface preclean. The same technology area includes silicon carbide epitaxy for high-voltage power-device wafers used in electric vehicles and renewable energy. Named tool series remain capabilities of this epitaxy platform rather than separate listings. Epitaxy is distinct from ASM atomic layer deposition, which is listed separately. Process recipes and tool configurations should be confirmed on ASM’s current epitaxy pages.
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
Related solutions
22ULP/ULL
FoundriesUMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solution28nm HKMG Process
FoundriesSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry
Foundries3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionAGNIT GaN wafer and device development
Manufacturing MaterialsGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionAIXTRON G10-SiC epitaxy system
Manufacturing EquipmentEpitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionFrom the same provider
Related events