NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Universal-H300
Universal-H300 is the 12-inch CMP equipment Hwatsing publishes for leading-edge planarization.
Overview
Hwatsing Universal-H300 is a 300 mm chemical-mechanical polishing tool for integrated circuits, advanced packaging and silicon wafers.
The official product page describes one platen with two polishing heads, eight-zone polishing heads, endpoint detection and modular horizontal cleaning, for integrated circuits, advanced packaging and large silicon wafers.
Technical capabilities
Dual polishing heads, multi-zone heads and modular cleaning
Lifecycle and categories
- Lifecycle stages
- Wafer fabricationPackaging and chiplets
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