KLA wafer defect inspection and review systems
Manufacturing EquipmentProcess-control equipment for detecting and reviewing defects during semiconductor manufacturing.
View solutionFoundries, process nodes and specialty processes.
Process-control equipment for detecting and reviewing defects during semiconductor manufacturing.
View solutionLam Research wafer-process equipment category for thin-film deposition, plasma etch, strip, clean and related fabrication steps. SABRE ECD is listed separately.
View solutionLam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.
View solutionNova describes Prism as an optical critical-dimension metrology platform that combines spectral information with modeling and machine learning.
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NAURA’s plasma etch platform is a wafer-fabrication etch tool family published on NAURA’s official product pages.
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AMEC Primo is a plasma etch equipment platform published on AMEC’s official product pages.
View solutionSkyWater RH90 is a radiation-hardened 90 nm CMOS foundry process, not processor IP and not a packaged rad-hard MCU.
View solutionSCREEN SU Series is a single-wafer cleaning equipment family, currently described through SU-3400.
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SUMCO describes silicon wafers as polished disks sliced from high-purity silicon and used as the starting material for semiconductor devices.
View solutionSamsung’s 3 nm foundry node introduced Gate-All-Around transistors as Multi-Bridge-Channel FETs (MBCFET): stacked nanosheet channels with the gate on all four sides, replacing FinFET for better electrostatic control.
View solutionTower Semiconductor SiGe BiCMOS is a specialty analog/RF foundry process combining silicon-germanium HBTs with CMOS.
View solutionSoitec lists engineered-substrate platforms including FD-SOI, RF-SOI, Power-SOI, and Photonics-SOI.
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