Public source
Lam Research Etch and Deposition
Lam Research publishes a portfolio of wafer fabrication processes used to build semiconductor devices, with primary public categories covering thin-film deposition and plasma etch, plus related strip, clean and mass-metrology offerings.
Overview
SABRE ECD is listed separately.
Official process pages describe deposition methods such as CVD, PECVD and ALD, and etch methods including reactive ion etch and atomic layer etch for conductor, dielectric and high-aspect-ratio structures. This listing remains the broader etch and deposition process category rather than a single tool model. SABRE is Lam’s named electrochemical copper-deposition family and is listed independently. Tool configurations and process recipes remain with Lam Research.
Technical capabilities
Related strip, clean and process-monitoring offerings described by the supplier
Distinct from the separately listed SABRE electrochemical deposition platform
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
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