NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Lam Research SABRE Electrochemical Deposition
SABRE is Lam Research’s publicly named electrochemical deposition family for copper interconnect.
Overview
Official product pages describe SABRE ECD as equipment for copper damascene manufacturing, addressing void-free fill, high-aspect-ratio structures and related logic and memory interconnect, including high-bandwidth memory. Named SABRE series remain tool SKUs of this ECD platform rather than separate listings. SABRE is a wet copper-deposition technology, not a synonym for Lam’s broader plasma etch and deposition category, which is listed separately. Process recipes and tool configurations should be confirmed on Lam’s current SABRE pages.
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
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