
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
ASML TWINSCAN NXE systems are the company’s 0.33 numerical-aperture extreme ultraviolet lithography platform.
Official EUV product pages describe NXE tools as 13.5 nm scanners used in high-volume manufacturing of advanced logic and memory, including foundation layers of 7 nm, 5 nm and 3 nm nodes. Named models such as NXE:3800E, NXE:3600D and NXE:3400C are scanner SKUs of this platform, not separate listings. NXE is distinct from TWINSCAN EXE High-NA (0.55 NA) EUV, which is listed separately, and from TWINSCAN DUV systems that print remaining chip layers. Throughput and overlay figures should be taken only from ASML’s current product documentation.
UMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solutionSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionEpitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
View solution