NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
ASML TWINSCAN DUV Lithography
ASML TWINSCAN DUV systems are the company’s deep-ultraviolet lithography platform.
Overview
Distinct from NXE and High-NA EXE EUV.
Official DUV product pages describe immersion ArF tools as high-volume workhorses for advanced logic and memory, and dry ArF, KrF and i-line tools for remaining layers that do not require EUV. Individual NXT and XT scanner models are SKUs of this platform, not separate listings. ASML states that EUV prints the most intricate layers while DUV prints the rest, and that both will be required in parallel for many years. Overlay, throughput and node claims should be taken from ASML’s current DUV documentation.
Technical capabilities
Described for high-volume logic and memory manufacturing alongside EUV
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
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