NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
Applied Materials Endura PVD
Endura is Applied Materials’ publicly named ultra-high-vacuum metallization platform.
Overview
Official product pages describe Endura PVD as a multi-chamber system for depositing ultra-pure films used in front-end metallization, aluminum and copper interconnect, and related packaging metallization. The platform can host multiple process and preclean chambers for integrated sequences under vacuum. Endura is a metallization/PVD equipment platform, not the newer Vistara wafer-manufacturing chassis, which is listed separately. Chamber options, film stacks and performance data should be confirmed with Applied Materials.
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
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