NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
ASML TWINSCAN EXE High-NA EUV
ASML TWINSCAN EXE systems are the company’s High-NA EUV lithography platform.
Overview
Official product pages describe EXE tools as 0.55 numerical-aperture EUV scanners that use a 13.5 nm light source and anamorphic optics. Named models such as TWINSCAN EXE:5000 and TWINSCAN EXE:5200B are scanner SKUs of this platform, not separate listings. ASML presents High-NA EUV as a way to print finer features with fewer multi-patterning steps than lower-NA NXE EUV systems. TWINSCAN NXE (0.33 NA) EUV and TWINSCAN DUV are listed separately. Throughput, overlay and node-readiness claims should be taken only from ASML’s current product documentation.
Technical capabilities
Described for advanced logic and memory manufacturing
Lifecycle and categories
- Lifecycle stages
- Wafer fabrication
Related solutions
22ULP/ULL
FoundriesUMC 22ULP/ULL is the foundry’s 22-nanometer ultra-low-power / ultra-low-leakage logic process platform.
View solution28nm HKMG Process
FoundriesSMIC 28nm HKMG is the foundry’s published 28-nanometer high-k metal-gate logic process, documented in SMIC newsroom coverage.
View solution3D AI Foundry
Foundries3D AI Foundry is a publicly named Powerchip foundry ecosystem.
View solutionAGNIT GaN wafer and device development
Manufacturing MaterialsGaN wafer and application-specific device development for RF and related semiconductor projects.
View solutionAIXTRON G10-SiC epitaxy system
Manufacturing EquipmentEpitaxial deposition equipment for silicon-carbide semiconductor manufacturing.
View solutionASM Atomic Layer Deposition (ALD)
Manufacturing EquipmentASM Atomic Layer Deposition technology enables highly controlled, layer-by-layer deposition of ultrathin conformal films for advanced semiconductor logic, memory and packaging structures.
View solutionRelated events