ERS electronic

GermanyGermering (HQ)

German semiconductor-equipment company that publishes thermal-management solutions for wafer test and advanced packaging. Official pages describe AirCool thermal chucks, debonding equipment, and a fully automated 310 × 310 mm panel-level packaging system manufactured at its Advanced Packaging facility in Barbing, Germany. Headquarters are listed in Germering, near Munich.

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Packaging and chiplets From published solutions.

Published solutions

1 published solution.

ERS Fully Automated 310 × 310 mm Panel-Level Packaging System
Fully automated 310 × 310 mm panel-level packaging system from ERS electronic that integrates temporary carrier bonding, debonding and detaping. The first unit has been delivered to a semiconductor manufacturer for panel-line integration.
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ERS electronic

Lifecycle coverage

Published solutions

ERS Fully Automated 310 × 310 mm Panel-Level Packaging System