Save a solution from IP Finder, a solution listing, a solution page, or a provider’s solutions to compare it here.
Saved in this browser. Information is based on published sources. Confirm suitability and configuration with the provider.
Austria
IC-substrate company that publishes high-density build-up substrates used to connect advanced processors to system boards.
1 published solution.
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
