NOV152026
Conference
SC26
- November 15 – 20, 2026
- Chicago, Illinois, USA
- Organized by SC Conference Series
Public source
SWIFT High-Density Fan-Out
SWIFT High-Density Fan-Out is a publicly named Amkor Technology packaging platform.
Overview
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
Official Amkor pages present SWIFT as a high-density fan-out wafer-level package family. This listing records the SWIFT platform rather than every Amkor package type. Design rules should be confirmed on Amkor’s current SWIFT pages.
Technical capabilities
OSAT packaging rather than a foundry process
Lifecycle and categories
- Lifecycle stages
- Packaging and chiplets
- Solution categories
- Packaging
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