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Cadence Integrity 3D-IC Platform

The Cadence Integrity 3D-IC Platform is a publicly named software environment for multi-die semiconductor design.

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Overview

Official Cadence pages describe unified system-level planning, implementation and signoff for 2.5D and 3D stacked-die configurations, including chiplet integration. The platform is presented as working with Cadence digital, analog and packaging tools so teams can analyze thermal, electrical and related system effects. This independent listing summarizes the named design platform. License options, foundry support and analysis coverage should be confirmed with Cadence.

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Physical design
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Physical Design

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Synopsys Fusion Compiler

Physical Design

Synopsys Fusion Compiler is an RTL-to-GDSII implementation system with one data model and built-in signoff timing, extraction, and power analysis. It is an EDA tool, not a foundry process.

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NOV152026
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SC26

  • November 15 – 20, 2026
  • Chicago, Illinois, USA
  • Organized by SC Conference Series
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