Eliyan NuLink Die-to-Die PHY IP (UCIe/BoW)

Eliyan NuLink PHY is licensable die-to-die and chip-to-chip interconnect PHY IP.

For standard packaging, NuLink-SP PHYs target organic/laminate packages with 100–130 µm bump pitch and industry standards including UCIe and BoW, plus UMI and SBD variants; a metrics table lists example NuLink UCIe unidirectional configurations at 32 or 64 Gbps/lane on 5/3/2 nm process nodes with 32 Tx+32 Rx lanes. For advanced packaging, NuLink-AP PHYs target 40–55 µm bump pitch interposers/bridges with UCIe and SBD options and example 40 Gbps/lane UCIe unidirectional metrics. NuLink-XS C2C PHYs for longer-reach PCB connections are also tabulated. NuLight optical chiplet products are separate finished chiplet offerings on the same page and are not this PHY listing. Official page clearly positions NuLink as PHY IP cores; NuLight chiplets excluded from this listing.