Conference
IMAPS Device Packaging Conference 2027
23rd IMAPS Device Packaging Conference, March 1–4, 2027 at the Sheraton Grand at Wild Horse Pass in Chandler, Arizona.
- March 1 – 4, 2027
- Sheraton Grand at Wild Horse Pass
- Chandler, Arizona, USA
- In-person
- Organized by International Microelectronics Assembly and Packaging Society (IMAPS)
About this event
The official IMAPS event record lists March 1–4, 2027 at the Sheraton Grand at Wild Horse Pass, 5594 W Wild Horse Pass Blvd., Chandler, Arizona 85226, and says online registration is available through March 1, 2027. IMAPS describes the 23rd conference as a forum on advanced packaging for AI scaling, including heterogeneous and 3D integration, RF data communications, and co-packaged optics. Some IMAPS pages also describe the same hotel as Phoenix.
Event focus
- ExploreDiscover cutting-edge technologies, products and solutions from across the semiconductor supply chain.
- ConnectBuild relationships with industry leaders, potential partners and the global semiconductor community.
- LearnGain insights from expert speakers, technical sessions and industry forums covering the most important trends and opportunities.
