Find SoC solutions, providers and technical resources.
18 direct solutions, 28 providers, 14 related for “packaging”
Kulicke & Soffa Industries · Packaging
…& Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AT&S · Packaging
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
BE Semiconductor Industries · Packaging
…es present Datacon equipment for hybrid bonding in advanced packaging. This listing records the hybrid-bonding platform rather than every Besi die-attach tool. Process options shou…
HANMI Semiconductor · Packaging
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
Amkor Technology · Packaging
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
ASE Technology Holding · Packaging
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
Advanced Micro Devices · Packaging
AMD 3D V-Cache is a publicly named 3D packaging technology that stacks an L3 cache tile on a CPU core-complex die. Official AMD product-brief materials describe copper-to-copper hy…
TSMC · Packaging
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
Intel Corporation · Packaging
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
TSMC · Packaging
…eneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
TSMC · Packaging
TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
TSMC · Packaging
TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.
23rd IMAPS Device Packaging Conference, March 1–4, 2027 at the Sheraton Grand at Wild Horse Pass in Chandler, Arizona.
The 77th Electronic Components and Technology Conference, June 1–4, 2027 at the Gaylord Rockies Resort & Convention Center in Denver.
26th European Microelectronics & Packaging Conference, September 14–16, 2027 at the Maritim Hotel in Ingolstadt.
