Find SoC solutions, providers and technical resources.
18 direct solutions, 14 related for “packaging”
Kulicke & Soffa Industries · Packaging
…& Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AT&S · Packaging
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
BE Semiconductor Industries · Packaging
…es present Datacon equipment for hybrid bonding in advanced packaging. This listing records the hybrid-bonding platform rather than every Besi die-attach tool. Process options shou…
HANMI Semiconductor · Packaging
HANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
Amkor Technology · Packaging
Amkor SWIFT is a high-density fan-out packaging platform for fine-pitch RDL and multi-die construction.
ASE Technology Holding · Packaging
ASE VIPack is ASE’s heterogeneous-integration packaging platform for high-density chiplet and advanced-package construction.
Advanced Micro Devices · Packaging
AMD 3D V-Cache is a publicly named 3D packaging technology that stacks an L3 cache tile on a CPU core-complex die. Official AMD product-brief materials describe copper-to-copper hy…
TSMC · Packaging
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
Intel Corporation · Packaging
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
TSMC · Packaging
…eneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
TSMC · Packaging
TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
TSMC · Packaging
TSMC umbrella family of 3D silicon stacking and advanced packaging. CoWoS, TSMC-SoIC and InFO are constituent platforms listed separately.
