GlobalWafers silicon wafer products
Manufacturing MaterialsSilicon wafer product families for semiconductor manufacturing.
View solutionServices & Manufacturing
Services and manufacturing partners. A foundry is not a packaging house, and a design service is not licensable IP unless the listing says both.
Showing 37–48 of 92 solutions.
GlobalWafers silicon wafer products
Manufacturing MaterialsHigh-Performance IC Substrate Platform
Packaging
AT&S high-performance IC substrates are build-up package substrates that connect advanced processors to system boards, not generic PCBs and not OSAT assembly.
View solutionIC1000 CMP Pads
Manufacturing Materials
Qnity lists the IC1000 series as hard CMP polishing pads for copper bulk, tungsten, STI and ceria, oxide, and buff.
View solutionIII-V Foundry Process Platform
Foundries
MACOM’s European Semiconductor Center publishes GaAs and GaN III-V foundry processes for microwave and mmWave devices.
View solutionInfineon custom ASIC development
Design Services
Custom ASIC development combining analog, mixed-signal, power, or security expertise.
View solutionIntel EMIB Advanced Packaging
Packaging
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
View solutionIntel Foveros
PackagingIntel Foundry 3D stacking and 2.5D chiplet packaging family, including hybrid-bonding options described as Foveros Direct 3D. EMIB is a separate 2.5D bridge platform.
View solutionKLA wafer defect inspection and review systems
Manufacturing Equipment
Process-control equipment for detecting and reviewing defects during semiconductor manufacturing.
View solutionMSPM0G3507
Commercial SoCs
TI lists the MSPM0G3507 as an 80 MHz Arm Cortex-M0+ microcontroller with 128 KB flash, 32 KB SRAM, and CAN FD.
View solutionMarvell Custom ASIC solutions
Design Services
Custom ASIC development and integration for demanding compute and connectivity designs.
View solutionMediaTek Custom ASIC Services
Design Services
Customer-specific ASIC development using MediaTek silicon design capabilities.
View solutionMosChip Silicon Engineering Services
Design Services
Silicon engineering services. Physical design and sign-off are documented on the design-services page. Package, assembly, ATE test, and qualification are documented on the turnkey page as coordination with foundry and OSAT partners.
View solution
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