Dual TC Bonder
PackagingHANMI Dual TC Bonder is a thermocompression bonding platform for HBM die stacking.
View solutionServices & Manufacturing
Services and manufacturing partners. A foundry is not a packaging house, and a design service is not licensable IP unless the listing says both.
Showing 25–36 of 92 solutions.
Dual TC Bonder
PackagingElite360 GaN & GaAs Foundry
Foundries
Elite360 GaN & GaAs Foundry is a publicly named Qorvo foundry offering.
View solutionElmos ASIC design services
Design Services
Customer-specific ASIC development from a mixed-signal semiconductor supplier.
View solutionEmbedded Memory Process Platform
Foundries
Hua Hong’s embedded memory process platform is a specialty foundry offering for embedded non-volatile memory on logic processes.
View solutionEntegris CMP materials and process consumables
Manufacturing Materials
CMP materials and associated consumables for semiconductor fabrication processes.
View solutionEspressif ESP32-P4 SoC
Commercial SoCs
RISC-V MCU-class SoC with image, voice, and peripheral processing capabilities.
View solutionFOX-XP
Test & Qualification
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
View solutionFlexIC Foundry
Design Services
Pragmatic describes the FlexIC Foundry as fabrication of flexible thin-film ASICs, using industry-standard ASIC design flows and taking a design from tape-out to delivery.
View solutionGCT GDM7275X cellular SoC
Commercial SoCs
A cellular modem SoC platform for compatible communication products.
View solutionGigaDevice GD25/GD55 serial NOR flash
External Memory Devices
Serial NOR flash device families for compatible boot and data storage.
View solutionGlobalFoundries 22FDX FD-SOI
Foundries
22FDX is GlobalFoundries’ 22 nm fully depleted SOI platform: a thin-body transistor on an insulating layer, targeting low-power, RF, automotive and IoT designs that do not need leading-edge GAA.
View solutionGlobalFoundries GlobalShuttle
FoundriesGlobalFoundries GlobalShuttle is a multi-project wafer program. It is a foundry service, not a process node and not fabrication equipment.
View solution
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