Discover 169 technologies from leading innovators around the world.
Microchip PolarFire SoC combines a coherent multi-core RISC-V CPU subsystem with PolarFire FPGA fabric on one device for Linux and real-time embedded systems.
IndustrialMedicalAerospace & Defense+1View Technology
Microchip PolarFire is a mid-range FPGA family providing programmable logic fabric, optional high-speed serial transceivers and on-chip interface IP for communications, imaging and embedded systems.
IndustrialMedicalTelecommunications+1View Technology
STPOWER GaN is STMicroelectronics’ gallium nitride power-transistor family, including intelligent integrated STi2GaN solutions. Distinct from STPOWER silicon carbide MOSFETs.
AutomotiveIndustrialView Technology
Lam Research SABRE is an electrochemical copper-deposition platform for damascene interconnect, including logic, memory and high-bandwidth memory wiring. Distinct from Lam’s broader etch category.
AI & HPCData CenterView Technology
Synopsys HBM interface IP is a high-bandwidth memory interface family including controller, PHY and verification IP for AI and high-performance computing SoCs. Distinct from UCIe die-to-die IP.
AI & HPCData CenterView Technology
ASM epitaxy is a crystalline film-growth equipment platform covering silicon and silicon-germanium transistor epitaxy and silicon carbide epitaxy. Distinct from ASM atomic layer deposition.
AutomotiveAI & HPCEnergyView Technology
Infineon OptiMOS is a low- and mid-voltage trench silicon MOSFET technology family for high-frequency power conversion. Distinct from CoolMOS, CoolSiC and CoolGaN.
AutomotiveData CenterIndustrial+1View Technology
KLA overlay and dimensional metrology systems measure layer-to-layer alignment, critical dimensions and related pattern geometry. Distinct from defect inspection and review.
AutomotiveData CenterConsumer ElectronicsView Technology
Applied Materials Endura is an ultra-high-vacuum metallization platform used for physical vapor deposition and integrated multi-chamber sequences. Distinct from the Vistara wafer-manufacturing chassis.
AI & HPCData CenterView Technology
ASML TWINSCAN DUV is the deep-ultraviolet lithography platform covering immersion and dry scanners that print most chip layers alongside EUV. Distinct from NXE and High-NA EXE EUV.
AI & HPCConsumer ElectronicsView Technology
NVIDIA NVLink is a high-bandwidth GPU-to-GPU interconnect and rack-scale fabric for AI training and inference. Distinct from NVLink-C2C chip-to-chip packaging links.
AI & HPCData CenterView Technology
Infineon CoolMOS is a high-voltage silicon superjunction MOSFET technology family for offline and high-voltage power conversion, distinct from CoolSiC, CoolGaN and OptiMOS.
Data CenterIndustrialConsumer Electronics+1View Technology
TSMC InFO is a wafer-level integrated fan-out packaging platform using high-density redistribution layers for mobile, network and high-performance computing integration.
AI & HPCConsumer ElectronicsTelecommunicationsView Technology
ASML TWINSCAN NXE is the 0.33 numerical-aperture EUV lithography platform used in high-volume manufacturing of advanced logic and memory chips. Distinct from High-NA EXE systems.
AI & HPCConsumer ElectronicsView Technology
Intel EMIB is a 2.5D packaging technology that embeds a silicon interconnect bridge in the package substrate to connect neighboring dies without a full-size interposer.
AI & HPCData CenterView Technology
TSMC-SoIC is a wafer-level frontend 3D chip-stacking platform for homogeneous and heterogeneous chiplets, distinct from CoWoS 2.5D packaging and InFO fan-out.
AI & HPCData CenterView Technology
TSMC CoWoS is a 2.5D advanced packaging platform that integrates logic dies and high-bandwidth memory on an interposer for high-performance computing and AI systems.
AI & HPCData CenterView Technology
Signalchip Agumbe is a wireless semiconductor chipset family covering LTE baseband and RF transceiver devices for cellular communications equipment.
TelecommunicationsIoTView Technology
Morphing Machines REDEFINE is a many-core processor architecture that instantiates domain-specific compute structures on a shared fabric at runtime.
AutomotiveAI & HPCTelecommunicationsView Technology
FermionIC publishes multi-protocol SERDES semiconductor IP for high-speed chip-to-chip and system connectivity across advanced digital interfaces.
AI & HPCData CenterTelecommunicationsView Technology
Netrasemi NETRA A2000 is a mid-range edge AI system-on-chip for on-device machine-learning, vision and signal-processing workloads in embedded systems.
AutomotiveAI & HPCIndustrial+1View Technology
InCore publishes configurable RISC-V processor IP through an automated Core-hub generator that produces synthesizable core instances for custom semiconductor systems.
AI & HPCIndustrialIoTView Technology
AGNIT publishes gallium nitride semiconductor technology spanning epitaxial wafers and RF devices for high-frequency and high-power electronic systems in telecommunications and related strategic applications.
AutomotiveTelecommunicationsAerospace & DefenseView Technology
Mindgrove Secure IoT is a RISC-V-based microcontroller/SoC family for connected and embedded devices, combining a processor core with peripherals, hardware crypto accelerators and on-chip secure memory.
IndustrialConsumer ElectronicsIoTView Technology
