Discover 169 technologies from leading innovators around the world.
NB-IoT system-on-chip that WiSig Networks describes as a 3GPP-compliant device with satellite non-terrestrial-network support and edge AI.
TelecommunicationsIoTView Technology
Saankhya Labs' Pruthvi-3 is a software-defined radio chipset series spanning baseband, mobile-receiver and modulator devices.
TelecommunicationsIoTView Technology
Ultra-low-power connected-device system-on-chip that Sensesemi describes with wireless connectivity, a microcontroller, and an edge AI accelerator.
Consumer ElectronicsMedicalIoTView Technology
Metering system-on-chip that Vervesemi describes as an analog front end integrated with a microcontroller for single-phase energy measurement.
IndustrialEnergyView Technology
Aheesa's Vihaan-I is a RISC-V networking SoC for fiber broadband. First-pass silicon was announced in 2026, with production tape-out targeted for 2027.
AutomotiveIndustrialTelecommunications+1View Technology
Kulicke & Soffa APTURA is a thermo-compression bonder for advanced packaging, not a wire bonder catalog and not OSAT assembly.
AI & HPCData CenterConsumer ElectronicsView Technology
Photronics advanced IC photomasks are lithography reticles for integrated circuits, not a foundry node and not FPD masks.
AutomotiveAI & HPCConsumer ElectronicsView Technology
AlphaSGT is Alpha and Omega’s shielded-gate trench MOSFET technology, not a GaN HEMT and not a power-module substrate.
AI & HPCData CenterIndustrialView Technology
QuickLogic Australis is embedded FPGA IP, not a standalone FPGA chip and not a foundry process.
AI & HPCIndustrialAerospace & Defense+1View Technology
Elmos automotive motor-control ICs are mixed-signal BLDC driver chips, parked in Design & IP because Analog / Mixed Signal does not exist.
AutomotiveIndustrialView Technology
CEVA-NeuPro-Nano is edge NPU processor IP, not a discrete accelerator chip and not a full SoC.
AI & HPCConsumer ElectronicsIoTView Technology
Cohu Diamondx is semiconductor ATE instrumentation, not a handler and not a probe card.
AutomotiveAI & HPCIndustrial+1View Technology
ESP32 is Espressif’s Wi-Fi and Bluetooth SoC platform, not a module SKU catalog and not processor IP.
IndustrialConsumer ElectronicsIoTView Technology
Aehr FOX-XP is a multi-wafer burn-in and test system, not a packaged-device ATE rack and not a probe card.
AutomotiveAI & HPCEnergyView Technology
Arteris FlexNoC is on-chip network IP, not a packaged interconnect chip and not a coherent cache controller.
AutomotiveAI & HPCData CenterView Technology
GCT GDM7243SL is a 450 MHz LTE IoT baseband chip, not a module SKU and not processor IP.
IndustrialTelecommunicationsIoTView Technology
Micronics Japan MEMS-SP is a MEMS probe-card technology for wafer test, not a handler and not a packaged-device socket.
AutomotiveAI & HPCConsumer ElectronicsView Technology
SkyWater RH90 is a radiation-hardened 90 nm CMOS foundry process, not processor IP and not a packaged rad-hard MCU.
IndustrialAerospace & DefenseView Technology
Ambiq SPOT is subthreshold MCU circuit technology, not a wireless protocol stack and not a foundry process.
AI & HPCConsumer ElectronicsMedical+1View Technology
Tekscend semiconductor photomasks are lithography reticles, not a foundry process node and not a mask writer.
AutomotiveAI & HPCConsumer ElectronicsView Technology
MARUWA silicon-nitride substrates are ceramic power-module boards, not a silicon wafer and not a packaged MOSFET.
AutomotiveIndustrialEnergyView Technology
Valens Stello VS3000 is high-speed connectivity silicon for AVoIP, not processor IP and not a finished camera.
IndustrialConsumer ElectronicsMedicalView Technology
AXT VGF substrates are III-V wafers grown by vertical gradient freeze, not epiwafers and not finished RF chips.
Data CenterTelecommunicationsAerospace & DefenseView Technology
SEALSQ VaultIC is a secure-element chip family, not a software PKI service and not a wireless modem.
AutomotiveIndustrialAerospace & Defense+1View Technology
